Serial Number Design Builder

Heckel Bassoons. Last update. Heckel Bassoon Documents. I have obtained some documents that Heckel used during the 1. Several of these documents had been used for years. A document showing the intonation. Heckel bassoons serial 1. A line drawing of the two models. Heckel bassoons offered in 1. An order form for a Heckel bassoon in 1. The handwritten figures were the. Deutsch Marks to dollars at the time. The most blessed event the letter. RS232 Hex Com Tool, an easy to use serial software terminal. RS232M Com Monitor for serial monitoring, troubleshooting. RS232 Com Tap Data Monitor. Web editor for Mac, Windows and Linux. The quickest way to work with Bootstrap, Foundation, responsive designs or plain HTML. Download free trial. Heckel bassoon. is nearly completed. Time to warn your bankerHeckel Bassoon Options. In the past, Heckel offered a wide array of models of bassoons. At the time of Heckels 1. Heckel. catalog listed 2. Heckel bassoon including the model 4. Ppt Presentation On Artificial Intelligence more. This model was reportedly produced for tropical climates. Keywork options were offered by way of these different models. Desc/18/172846/1.jpg' alt='Serial Number Design Builder' title='Serial Number Design Builder' />The model number 4. German system bassoons. Environment variable Catalog ItemBuild option Effect BSPRTCWAKESCPU External RTC wake up Enables the ability for the RTC to wake the system up from suspend. The part design versus instantiations of it. As a part number is an identifier of a part design independent of its instantiations, a serial number is a unique. Knex. js is a batteries included SQL query builder for Postgres, MSSQL, MySQL, MariaDB, SQLite3, and Oracle designed to be flexible, portable, and fun to use. Tabtight professional, free when you need it, VPN service. World System. keywork left hand French system, right hand German system. Currently, Heckel produces only one model of the bassoon, the 4. Click here to see the standard catalog options offered for a new Heckel bassoon. Heckel Bassoon Notes. Instrument identification   Serial Numbers. The Heckel firm was founded in 1. New-Flex-Project-3.png' alt='Serial Number Design Builder' title='Serial Number Design Builder' />The first serial number stamped was 3. Heckel bassoon serial numbers are assigned when the wood for the instrument is chosen. After the serial number is assigned the wood is cured for at least 1. This can cause variations in serial numberyear progression it is possible. Heckel bassoon serial numbers are not continuous. There are known gaps. The reason for these gaps is not always known even by the factory. For example, according to company sources. Manufacturing Mark. Heckel bassoons also have a manufacturing mark. The manufacturing mark is a number. This number can be found in Arabic form under the boot cap following the serial number. Roman numeral form inscribed on the underside of the keys. It can also be found by a series of small pin holes, or dots punched in the. Serial Number Design Builder' title='Serial Number Design Builder' />These dots are typically found under keys so that they cannot be seen when the instrument. This web page uses the convention serialmanufacturing mark. This number is sometimes erroneously referred to as a. The manufacturing mark does not connect a specific instrument with a specific builder or build desk in any way. Construction Changes Through History   Rubber bore liner. The hard rubber liner was introduced and patented by Wilhelm Heckel in 1. Flat Back Long Joint. In the late 4. 00. Heckel changed from building flat back long joints to. Rfactor Pc Game'>Rfactor Pc Game. You can clearly see a flat back long joint on bassoon 4. The back of the long joint is built with a plateau, similar to what is still made for the wing C key. Long BoreShort Bore. During 1. 92. 2 around serial number 5. Heckel changed from building small bore. In order to accomidate this change, the wing, boot and long joint have shorter tube. In America the wide bore instruments are frequently referred to as short bore bassoons. Before serial number 5. Thick Wall Construction. In 1. 96. 3 around serial number 1. Heckel began making the walls of the bassoon thicker. The standard story explaining the reason for this changes was that the thinner walled instruments. Very recently the 1. Ivory Bell Ring. Real ivory was used for the ivory bell ring until the 1. From that point on, a very good imitation made of plastic has been used. According to recent reports, Heckel has once again begun using real ivory. African animal management programs. However, new bassoons sent to the US will continue to have plastic rings. US ivory importation laws. Low D Key Guard. The shape of Low D key guard has changed over time. Originally, the Low D key guard was a half cap over the lower half of the Low D key cup. By the time of the manufacture of 3. Later the guard changed to a bar similar to the modern Bb key guard on the back of the boot joint. During the 6. 00. Low D key guard became the shape that it continues to have today. Back Ab Key. Heckel bassoons until 7. Ab key as a separate tone hole on the back of the boot. After 7. 40. 0 the default mechanism for the. Ab key was to operate the front Ab key via a connecting rod through the boot joint. The back Ab key as a separate tone hole is still available as option 1. Low G Key. The Low G key was originally connected from front to back by a keywork mechanism that wrapped around. This permanently changed between 4. The following is an explanation of some of the typical variations you may find in instrument descriptions. World System. You will notice some instruments listed as World System. French left hand. Muccetti system after Enzo Muccetti. Pezzi system. These were all attempts to blend the French bassoon key system Boehm with the. German Heckel system. Typically this was done by building the left hand with the French. German key system, although the centennial 1. Heckel catalog. does contain some models that have right hand Boehm system keywork. Bell Shape. Heckel builds bassoons with what the factory calls three different styles of bells. German,French and Italian bells factory options 7. This indicates only the external shape of the bell. This terminology should not be confused with the type of bell ring. Heckel bassoon with a metal bell ring does not indicate a French bell. German bell with a metal bell ring. The French bell has a significantly different external shape. I have been told by Roger Birnstingl that the Italian bell also know as the. Muccetti bell has the same bore. It is also quite a bit lighter, weighing in at around 2. German bell. Gentlemens Model. Some instruments are listed as a Gentlemens model. These instruments have a joint lower on the top of the long joint. Low B and C keys which allows the instrument to be taken apart into. Typically there is still a normal bell joint option 8. Low B and C keys option 8. Notes about the instrument table. Heckel Bassoon Serial Numbers. For your convenience, you may use the following hyperlinks to jump directly to a specific. Heckel bassoon series. Serial Number. Date. Known Owners. Pictures. Description. History. Known Sales. 29. 99. Front. Back. Right thumb hole. U Tube. Front of boot. Back of boot. Old style HECKEL label. Back of wing. Front of wing. Long joint. Bell. This appears to be a pre 3. Heckel bassoon. I have assigned the ficticous serial number 2. Made of palisander wood. All joints. All joints flipped over. Heckel label on the wing joint. Front of wing and back of Long joint. This is the oldest known Heckel bassoon still in use. Low A for left little finger, Tristan Stuerze. In the Music Institut of the University of Tuebingen. Front. Back. 30. 50. Complete instrument. In Case. 12. 00. Bay3. There are indications that at one time this was a low A model. On pegs. Seen in the Kenmochi Bassoon Works Japan, 12. Full length. Bell. Left thumb area. Left thumb area 2Back of boot. Left thumb area 3Left thumb area 4Front of boot. Label on bell. 102. Detail of serial number. Instrument in case. Back of boot joint. Front of boot joint. Another view of the front of the boot joint. Side of boot joint, showing old style G key mechanism. Long joint showing flat back. Back of wing joint. Front of wing joint. Detail of low B key. Detail of low D key. Close up of winglong joint back. Close up of boot joint fronttop. Close up of boot joint backtop. Close up of boot joint frontbottom. Close up of boot joint backbottom. A4. 40, crook lock, front RH rollers, lined left hand tone holes. BayNebraska3. 31. Detail of serial number. Instrument in case. Instrument in case. Boot joint. Wing joint. Win. CE BSP ARM A8 User Guide Texas Instruments Wiki. Introduction. Contents of this guide have been updated to include Release 2. Users of earlier releases can still use this guide but support for new platforms AM3. AM3. 35x is only available in Release 2. This document provides information for the user of the Microsoft Windows Embedded CE 6. R3 BSP BSP or the Microsoft Windows Embedded Compact 7 BSP BSP for the Texas Instruments OMAPTM3. Evaluation Module EVM, AM3. Evaluation Module EVM, AM3. EVM and AM3. 35x General Purpose EVM. This combined offering is referred as TI ARMA8 BSP in this document. Instructions are provided for installing the BSP, building images and loading images onto the EVM. Requirements. There are many requirements for software, hardware, infrastructure and user experience level that should be met prior to working with EVM BSP and Windows CE. Required Experience. This document is not intended for novice Windows CE users. Readers unfamiliar with Windows CE are encouraged to seek training and to study the documentation included with Windows CE before using the TIARMA8 BSP and related documentation. Required Software. The following software must be installed prior to installing the TI ARMA8 BSP. Note that the software must be installed in the order listed. Contact Microsoft for more information about the listed software and known issues with the installation process. Visual Studio 2. 00. VS2. 00. 5 Visual Studio SP1 Service Pack 1 Windows Embedded CE 6. Plug In for Visual Studio 2. Windows CE 6. 0 SP1 Service Pack 1 Windows CE 6. R2 Update Windows CE 6. Cumulative Product Update Rollup Package 2. QFEs Windows CE 6. QFEs through November 2. Users new to Windows Embedded CE6 can obtain evaluation versions of the required software from Microsoft http msdn. For BSP 2. x. Microsoft Visual Studio 2. Professional Edition. Microsoft Visual Studio 2. Professional Service Pack 1. Windows Embedded Compact 7. Windows Embedded Compact 7 Updates update 1 to update 4 Oct 2. Required JTAG Tools. There are no JTAG tools required for use with above mentioned EVMs. Texas Instruments provides a tool that can be used to communicate with the internal boot ROM on the OMAP3. This tool can be used to program the bootloader into the EVM if there is no functional bootloader available. Required Network Capabilities. The EVM supports communications with the development PC running Platform Builder using either Ethernet or USB RNDIS. Platform Builder requires the device to be on the same subnet as the development PC. The bootloader and kernel support both manual and dynamic IP address assignment. DHCP is enabled by default this can be changed using the bootloader menu. Notation Conventions. The following section describes terms used in this document. CPU Name This document is written to support a number of EVMs mentioned above. The term OMAP3. 5xx will be used to indicate one of the CPU names OMAP3. AMDM3. 7x family supported by the OMAP3. EVM AM3. 5xx, AM3. AM3. 35x will be used to indicate one of the CPU names supported by their respective EVMs. When working with a particular CPU type, the term OMAP3. CPU. CPU family. EVMSupported CPU name OMAP3. OMAP3. 50. 33. 51. DM3. 73. 03. 72. AM3. AM3. 87x EVM Baseboard only. AM3. 35x EVM General Purpose, Profile 0. BSP Folder This document is written to support the following EVMs The BSP folders for these EVMs are as follows. OMAP3. 5x EVM platformEVMOMAP3. AM3. 5x EVM platformAM3. XBSPAM3. 87x EVM platformAM3. BSPAM3. 35x EVM platformAM3. BSPIn this document, the term BSP Folder will be used to refer to one of the above folders depending upon the context. TI EVM When not explicitly specified, TI EVM refers to any of the above mentioned EVMs. OMAP3. 5xx EVM also includes support for AM3. DM3. 7x processor family. WINCE OS When not explicitly specified, this content applies to both Win. CE 6. 0 R3 and WEC 7. For demonstration purposes, CE6 examples may be used. Unless otherwise specified in that section, similar principles apply for WEC 7 for those examples. Please use ARMV7 for CE7 and ARMV4. I for CE6. When version number is not explicity mentioned, then Windows Embedded CE and Win. CE terms refer to both Win. CE 6. 0 and WEC 7 in this document. When version number is not explicity mentioned, then Visual Studio and VS terms refer to both VS2. VS2. 00. 8 in this document. BSP Version BSP 1. Windows Embedded CE 6. BSP 2. x releases are based on Windows Embedded Compact 7. Other Terms Knowledge of Visual Studio, Platform Builder and Windows Embedded CE terms is assumed. The user should consult Platform Builder documentation for a definition of any unfamiliar terms. Related Documentation. This section describes other documentation that should be referenced when working with the TI ARMA8 BSP. Visual Studio Platform Builder Documentation This documentation is the primary reference material for understanding the Windows Embedded CE development system. Familiarity with this material is essential to successful Windows CE development using the EVM. EVM Board Schematics Schematics for the EVMs are included as part of the platform documentation. BSP Features. This chapter discusses features of the TI ARMA8 BSP. Bootloader EBOOTBootloader and Initialization Sequence. The TI EVM board boots from Flash memory using the internal boot ROM of the TI ARMA8 processor. The bootloader architecture consists of an initial bootstrap loader called the XLDR and a secondary loader called EBOOT. The internal boot ROM performs a minimum hardware setup, and then copies the XLDR from the first good block of Flash memory to a fixed location in internal SRAM. The boot ROM then jumps to the entry point of the XLDR. The XLDR is a BSP specific bootstrap loader whose function is to do basic hardware initialization and copy the second stage, full featured EBOOT from Flash memory into RAM for execution. The XLDRsize is limited by the size of internal SRAM and does not implement any features other than what are needed for bootstrap. Note the BSP only builds the XLDR in Release configurations. Debug configurations use un optimized code libraries that cause the XLDR to exceed the allotted size. The primary development bootloader is called EBOOT. The primary purpose of the EBOOT loader is to load the operating system image from a specified source and launch it. EBOOT also provides a serial based user interface that allows a developer to control various aspects of the loader behavior. Low Level Initialization. Low level hardware initialization is performed in the XLDR as part of its bootstrap requirements. This includes multifunction pin configuration, clock setup, chip select timings, and DDR configuration. The file. SRCBOOTLOADERXLDRplatform. This file must be modified for every hardware platform. The INC directory contains a number of header files with defines that control many of the timing and memory map related initialization parameters. Device Configuration Parameters. The bootloader provides user accessible configuration parameters that control various aspects of bootloader behavior. These parameters are primarily used during development to control where the OS image comes from, network configuration etc. Changes to the configuration parameters can optionally be saved to nonvolatile storage Flash memory and preserved across power cycles. The configuration parameters can be accessed by the user via the serial user interface.